March 5, 2025
TSMC N2 + Next-Gen SoIC, Intel EMIB-T, Meta 3D Stacked Memory, CFET, 2D Materials, and More – SemiAnalysis
The semiconductor industry isn’t built on overnight breakthroughs. It’s built on large leaps of progress, compounding year after year, at a higher rate than probably any other industry in history. The International Electron Device Manufacturing conference IEDM is one of the key venues where chipmakers can show off this progress. Paper topics range from commercially relevant, those that could eventually be, and others that probably won’t be but are interesting technology anyways. Semiconductors: incremental gains compounded over 50+ years. Source: AMD For logic: TSMC’s N2 process, 2D materials including Samsung and others, CFET advancements, and Intel scaling silicon channels beyond